Quantum Computing IncQUBT
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Q2 earnings expected to disappoint due to acquisition-driven growth, surging expenses, and continued losses.
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Quantum Computing▼ · 1 stocks
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Quantum Computing Inc. Signs Three-Year Framework Agreement With Hamad Bin Khalifa University
Quantum Computing Inc. has signed a three-year Framework Agreement with Hamad Bin Khalifa University in Qatar, under which QCi will provide cloud-based access to its Dirac-3 system along with an installation in Qatar to support the country's quantum ecosystem and regional leadership. The agreement supports QCi's Entropy Quantum Computing approach, which uses quantum entropy and decoherence as computational resources rather than relying on costly error correction and highly controlled environments. The Dirac-3 platform is a third-generation, rack-mountable system designed to solve complex, real-world optimization problems at room temperature. Among peers, IonQ had progressed through three rounds of tape-outs for its first semiconductor quantum chip and received 256-qubit prototypes by the second quarter of 2026, while Rigetti's 36-qubit Cepheus system uses four 9-qubit chiplets and its Cepheus-1-108Q uses 12 interconnected 9-qubit chiplets and became generally available in April 2026. Over the past year, QCi's shares have plunged 52.4% compared with the industry's 10.9% decline, and the stock trades at a forward 12-month price-to-sales of 40.24X versus the industry's average of 4.20X.
Quantum Computing Inc. to Debut Integrated Quantum Security Platform at ECOC 2026
Quantum Computing Inc. announced it will showcase, for the first time, an integrated quantum security platform combining encryption and authentication in a single solution at the ECOC Exhibition 2026, held September 21–23 at FYCMA in Málaga, Spain. At Booth #1436, the company will demonstrate live quantum communication solutions using time-frequency and polarization-based approaches, pairing quantum key distribution with hardware-based Quantum Identity Authentication. The platform combines high-dimensional quantum key distribution, direct entanglement verification, Quantum Identity Authentication, and integrated key management in a telecom-compatible architecture, and is based on QCi's patented invention recognized with the 44th Edison Patent Award, presented to Dr. Yuping Huang and Dr. Lac Nguyen. QCi will also present at the ECOC Product Focus Theatre on Wednesday, September 23, from 14:50 to 15:10, in a session titled "The Quantum Secure Solution: Quantum-authenticated communications for broad applications in security," delivered by Massimo Di Blasio, Director, Product Line Management/Business Development. Chief Technology Officer Yong Meng Sua said the demonstrations give the telecom industry a firsthand look at how quantum technologies can strengthen the security of tomorrow's communications.
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Anderon Finalizes $1 Billion CHIPS Award for Quantum Wafer Foundry
Anderon LLC, an IBM company, has finalized a $1 billion award under the CHIPS and Science Act with the U.S. Department of Commerce to accelerate its research and development of U.S.-based quantum wafer manufacturing. The award, first announced in May under a letter of intent between the Department and IBM, supports Anderon's state-of-the-art 300-millimeter pure-play quantum wafer foundry, which is backed by an additional $1 billion investment from IBM. Headquartered in Albany, New York, the venture serves the quantum industry as a pure-play foundry offering quantum wafer manufacturing to customers across the ecosystem. Anderon CEO Mukesh Khare said the agreement strengthens the company's ability to deliver the manufacturing scale the quantum industry needs, while Jay Gambetta, Director of IBM Research and an IBM Fellow, said Anderon's wafer fabrication focus gives IBM the foundation to execute its quantum roadmap. The company said its first quantum wafers are now running through its manufacturing facility, an early production milestone demonstrating its ability to translate advanced pre-production research into commercial-grade quantum wafer technologies.