Taiwan Semiconductor Manufacturing Co. Ltd.TSMC is expanding its CoWoS advanced packaging capacity to meet rising demand for silicon interposer-based AI accelerators and HBM integration.
The global silicon interposer market is projected to reach USD 14.04 billion by 2035, up from USD 4.00 billion in 2025, expanding at a compound annual growth rate of 13.38 percent during the forecast period, according to SNS Insider. The 2.5D silicon interposer segment held the largest revenue share in 2025 at nearly 58 percent, driven by widespread use in AI accelerators, GPUs, and high-bandwidth memory applications. North America led the market with approximately 49 percent revenue share in 2025, supported by major semiconductor manufacturers and hyperscale cloud providers, while Asia Pacific is expected to register the highest growth rate due to expanding foundry investments and AI infrastructure deployment in China, Taiwan, South Korea, and Japan. Recent developments include TSMC expanding its CoWoS advanced packaging capacity and Intel strengthening its EMIB and heterogeneous integration technologies to meet rising demand for silicon interposer-based AI accelerators and HBM integration.
Taiwan Semiconductor Manufacturing Co. Ltd.TSMC is expanding its CoWoS advanced packaging capacity to meet rising demand for silicon interposer-based AI accelerators and HBM integration.
Intel CorporationIntel is strengthening its EMIB and heterogeneous integration technologies to meet rising demand for silicon interposer-based AI accelerators.
Advanced Micro Devices IncGrowing silicon interposer market driven by AI accelerators and GPUs benefits AMD as a key user of these technologies.
International Business Machines