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STMicroelectronics N.V.Launches new VL53L9 3D LiDAR module for edge AI, a product innovation.
Monolithic Power Systems Inc
NXP Semiconductors NV
Paycom Software, Inc.
STMicroelectronics has introduced the FlightSense VL53L9, a compact direct Time-of-Flight 3D LiDAR module designed for high-resolution depth sensing in next-generation edge AI applications. The module features 2,268 sensing zones with a 54 by 42 resolution and a wide field of view, enabling detailed 3D mapping and precise detection of small objects at distances from less than five centimeters to nine meters with up to 1% accuracy and frame rates reaching 100 frames per second. Its AI-ready output and dual-scan flood illumination capture both 2D infrared and 3D depth images, reducing motion artifacts and simplifying deployment on low-compute edge AI systems. STMicroelectronics plans to begin mass production in early July 2026, with samples and volume shipments already available to customers globally. The company also completed the acquisition of NXP Semiconductors' MEMS sensor business in the first quarter of 2026, adding approximately $40 million in quarterly revenues, and expanded partnerships with NVIDIA and Amazon Web Services to strengthen its position in AI, automotive, and industrial markets.
STMicroelectronics N.V.Launches new VL53L9 3D LiDAR module for edge AI, a product innovation.
Monolithic Power Systems Inc
NXP Semiconductors NV
Paycom Software, Inc.