Advanced Micro Devices IncAMD is mentioned as a vendor optimizing AI workloads across heterogeneous SoC architectures, benefiting from the growing TinyML and edge AI chipset market.

ABI Research forecasts that TinyML AI chipset shipments excluding personal and work devices will surpass 4.1 billion units by 2031, growing at a 37% compound annual growth rate, with related revenue exceeding US$7.8 billion. The firm notes that embedded AI is scaling in industrial IoT and far-edge environments, with MCUs leading the TinyML segment through the decade while NPUs post the fastest growth at a 90% CAGR. In edge AI, Asia-Pacific is projected to expand at an 18% CAGR and exceed 721 million AI chipset shipments by 2031, while Europe and North America grow at 17% and 16% CAGRs respectively. The report also highlights that medium- to low-priced smartphones face near-term pressure from higher DRAM prices, prompting Xiaomi, vivo, and OPPO to reduce 2026 sales forecasts, while premium smartphones remain more resilient. Heterogeneous SoC architectures are gaining share as vendors including Qualcomm, MediaTek, Apple, AMD, and Intel optimize AI workloads across CPUs, GPUs, and NPUs.
Advanced Micro Devices IncAMD is mentioned as a vendor optimizing AI workloads across heterogeneous SoC architectures, benefiting from the growing TinyML and edge AI chipset market.
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Apple Inc.