Taiwan Semiconductor Manufacturing Co. Ltd.TSMC developing new advanced packaging technology to expand capabilities.
Taiwan Semiconductor Manufacturing Co. is reportedly developing an advanced chip packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge, internally called 'EMIB Like,' and is partnering with Taiwan's Kinsus Interconnect Technology on the project, according to The Information. The report also said Nvidia is evaluating Intel's EMIB packaging technology for a future processor. Intel has positioned EMIB as an advanced packaging technology that uses silicon bridges to connect multiple chip components, enabling larger, more complex processors while improving efficiency and reducing manufacturing costs. TSMC currently uses its advanced CoWoS packaging technology to produce AI chips for major customers including Nvidia and Advanced Micro Devices, and in April announced plans to expand CoWoS with a 14-reticle package slated for production in 2028. If TSMC launches an EMIB-like packaging technology, it could threaten a key factor that gave Intel Foundry an edge.
Taiwan Semiconductor Manufacturing Co. Ltd.TSMC developing new advanced packaging technology to expand capabilities.
Kinsus Interconnect Technology CorpKinsus partnering with TSMC on new packaging project, likely to gain business.
Intel CorporationTSMC developing EMIB-like technology threatens Intel's packaging edge.
NVIDIA CorporationNvidia evaluating Intel's EMIB, but no decision made; impact unclear.
Advanced Micro Devices Inc