Kinsus Interconnect Technology Corp

Taiwan Semiconductor Manufacturing is reportedly developing an advanced chip-packaging process resembling Intel's EMIB technology, escalating competition over a critical AI infrastructure bottleneck. TSMC is working with Taiwanese substrate supplier Kinsus Interconnect Technology on the EMIB-like process, according to The Information, as it seeks to offer a cheaper or more flexible alternative to its dominant CoWoS platform. Nvidia is reportedly evaluating Intel's technology for a future processor combining four GPU dies, highlighting why TSMC may need another option. The development threatens a rare opening for Intel Foundry, which describes EMIB as a system that links specialized chips through tiny embedded bridges to slash costs and boost AI performance. TSMC shares rose about 7.5% Thursday, while Intel gained roughly 13%.