Taiwan Semiconductor Manufacturing Co. Ltd.TSMC is developing an EMIB-like packaging to challenge Intel, expanding its AI packaging options and potentially winning more business.
Taiwan Semiconductor Manufacturing is reportedly developing an advanced chip-packaging process resembling Intel's EMIB technology, escalating competition over a critical AI infrastructure bottleneck. TSMC is working with Taiwanese substrate supplier Kinsus Interconnect Technology on the EMIB-like process, according to The Information, as it seeks to offer a cheaper or more flexible alternative to its dominant CoWoS platform. Nvidia is reportedly evaluating Intel's technology for a future processor combining four GPU dies, highlighting why TSMC may need another option. The development threatens a rare opening for Intel Foundry, which describes EMIB as a system that links specialized chips through tiny embedded bridges to slash costs and boost AI performance. TSMC shares rose about 7.5% Thursday, while Intel gained roughly 13%.
Taiwan Semiconductor Manufacturing Co. Ltd.TSMC is developing an EMIB-like packaging to challenge Intel, expanding its AI packaging options and potentially winning more business.
Intel CorporationIntel's EMIB technology is being evaluated by Nvidia and challenged by TSMC, highlighting its competitive position in AI packaging.
Kinsus Interconnect Technology CorpKinsus is working with TSMC on the new packaging process, likely increasing demand for its substrate products.
Qualcomm Incorporated
NVIDIA CorporationNvidia is evaluating Intel's EMIB for a future processor, but no decision or impact on Nvidia's own business is stated.
Apple Inc.
Advanced Micro Devices Inc