Shenzhen Kaifa Technology Co Ltd

Shenzhen Kaifa Technology announced on the evening of September 9 that its wholly owned subsidiary Payton Technology Shenzhen Co., Ltd. plans to implement a high-end memory chip packaging and testing capacity expansion project, with a total planned investment of 1.85 billion yuan, to seize advanced packaging opportunities brought by the AI industry. The project consists of two parts: first, an investment of 1.22 billion yuan to establish a new wholly owned subsidiary to build a new plant, capable of supporting 90,000 wafers per month of traditional packaging and testing and 10,000 wafers per month of 2.5D advanced packaging capacity; second, an investment of 630 million yuan to build a 2.5D and 3DS advanced packaging research and development line, which after reaching full production is expected to add 100 wafers per month of 2.5D and 3DS advanced packaging capacity respectively. In the first half of the year, Shenzhen Kaifa Technology achieved operating revenue of 8.278 billion yuan, up 6.96 percent year on year, and net profit of 543 million yuan, up 20.28 percent year on year. The company's share price has risen 38.41 percent cumulatively since the beginning of the year.

Shenzhen Kaifa Technology released its 2026 half-year report, with first-half net profit attributable to the parent rising 20.3% year-on-year to 543 million yuan. Operating revenue was 8.28 billion yuan, up 7.0% year-on-year; net profit attributable to the parent excluding non-recurring items was 504 million yuan, up 58.8% year-on-year; net operating cash flow was 118 million yuan, down 91.9% year-on-year. Second-quarter operating revenue was 4.55 billion yuan, up 4.1% year-on-year, and net profit attributable to the parent was 301 million yuan, up 10.4% year-on-year. The company said that, driven by the explosion of the AI computing power industry and continued rising demand for memory chips, the storage semiconductor industry is showing tight supply with both volume and price rising, and the company will continue to maintain its industry-leading position and promote breakthroughs in advanced packaging technology.