Artificial Intelligence▲
ASMPT Limited Secures Repeat Order for Eight TCB Tools, Deepening HBM and AI Packaging Role
ASMPT Limited announced a repeat order for eight chip-to-wafer Thermo-Compression Bonding tools from a leading global integrated device manufacturer. The order follows the customer's use of ASMPT's Firebird TCB tools in high-volume manufacturing since 2024. TCB technology is critical for high-bandwidth memory and advanced AI packaging as chip designs move toward 2.5D and 3D integration. In the first quarter of 2026, ASMPT's revenue rose 32.0% year over year to $507.9 million, while bookings increased 71.6% to $727.0 million.