LB Semicon Inc

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for integrated circuits, including gold bumped wafers, solder bumps, Cu pillar bumps, Au RDL, and thick Cu products. The company also provides chip probe testing and back-end services such as laminating, back grinding, laser marking, and packing. Founded in 2000, LB Semicon Inc. is based in Pyeongtaek-Si, South Korea.