Henkel AG & Co. KGaA

Henkel AG & Co KGaA reported organic sales growth of 3.2% for the first half of 2026, driven by a 1.1% contribution from pricing and a 2.1% increase in volume. Reported sales reached EUR10.3 billion, down 0.5% year-over-year due to a nearly 4% negative foreign exchange impact. Adjusted EBIT margin was 15.7%, slightly up, with adjusted EBIT at EUR1.6 billion and adjusted EPS for preferred shares at EUR2.86, a 7% increase at constant currencies. Adhesive Technologies delivered organic sales growth of 4.5% on sales of EUR5.5 billion and an adjusted EBIT margin of 17.7%, while Consumer Brands grew 1.7% organically on sales of EUR4.7 billion with a stable margin of 15.3%. The company upgraded its full-year 2026 organic sales growth guidance for the group to 1.5% to 3.5% and for Adhesive Technologies to 2% to 4%, citing strong first-half performance and confidence in the business.

CuspAI has launched the AI Materials Foundry, a global network uniting data, labs, compute, and scientific expertise to accelerate materials discovery, with over 45 founding members including NVIDIA, Meta, Samsung, Hyundai Motor Group, Henkel, Applied Materials, Tokyo Electron, and Lam Research. The network is orchestrated by CuspAI's proprietary AI platform, MIRA, which enables full discovery cycles from generative design through simulation, synthesis planning, and experimental validation, underpinned by the world's largest curated experimental materials datasets. NVIDIA will provide compute infrastructure, while Meta's Fundamental AI Research Team contributes its Universal Model for Atoms, a frontier atomistic chemistry model. Focus areas include semiconductors, clean energy, and advanced manufacturing, with regional hubs in the United States, Europe, and APAC. CuspAI has raised over $650 million from investors including Kleiner Perkins, NEA, Temasek, NVentures, Bezos Expeditions, Samsung, and Hyundai Motor Group.

The global semiconductor alloy solder powder market is projected to grow from $0.91 billion in 2026 to $1.2 billion by 2030, at a compound annual growth rate of 7%, according to a new report from ResearchAndMarkets.com. The market expanded from $0.86 billion in 2025 to $0.91 billion in 2026, a 6.8% increase, driven by semiconductor manufacturing expansion, rising consumer electronics demand, and advancements in electronic packaging. Growth is further fueled by electric vehicle electronics, miniaturized components, and high-performance computing, with key trends including lead-free solder powders and fine particle size powders for advanced packaging. North America led the market in 2025, while Asia-Pacific is expected to be the fastest-growing region. Major players include Henkel AG & Co. KGaA, DOWA Holdings Co. Ltd., Tamura Corporation, and Indium Corporation of America, which recently introduced SiPaste C312HF for system-in-package applications and acquired SAFI-Tech to enhance its nanosilver sintering technology.

The global methyl methacrylate adhesives market is projected to grow from USD 1.76 billion in 2025 to USD 2.46 billion by 2030, at a CAGR of 6.9%. Growth is driven by rising demand in automotive, construction, and wind energy sectors due to the adhesives' high strength and fast curing. The two-part pre-mix system segment is expected to hold the largest market share, favored for its reliability and adaptability. Asia Pacific leads the market, fueled by rapid industrialization in countries such as China, India, Japan, and South Korea. Key players include 3M, Henkel, and Sika AG.