Egide S.A. develops, manufactures, and sells hermetic package solutions for micro-electronic and optical product applications. With its subsidiaries, it operates in France, the rest of the EEC, the United States, Canada, and internationally. Its products include packages for the thermal imaging market, window assemblies, high-precision window holders, high temperature co-fired ceramic (HTCC) feedthroughs, hermetic housings, ceramic boards, getter welding, and cold fingers for cooled IR systems, as well as power packages. The company also provides protection and interconnection for opto-electronic chips, RF packages, RF and DC glass beads, SMPM connectors, and HTCC packages such as surface mount, lead-frame, and leadless packages, along with HTTC connectors and HTCC ceramic substrates. It serves the defense/space, telecommunications, industrial/energy, medical, opto-electronics, infra-red, sensors, RF, and communications markets, among others. Egide S.A. was incorporated in 1986 and is headquartered in Bollène, France.