Shenzhen Rongda Photosensitive & Technology Co Ltd

Rongda Photosensitive has released its 2026 private placement plan for specific investors, aiming to raise total proceeds of no more than 591 million yuan. Of this, 216 million yuan will be used for the construction of a Guangzhou production base. Once completed, the project will have an annual output of 6,000 tons of high-end PCB photosensitive solder resist ink and 300 tons of inkjet ink, covering high-precision fields such as AI servers and IC substrates. Another 215 million yuan will be invested in building a processing base in Thailand, establishing a production line with an annual capacity of 6,000 tons of PCB ink and supporting dry film slitting capacity, to serve Southeast Asian PCB customers venturing overseas. The remaining 160 million yuan will fully supplement working capital. The company's net profit attributable to shareholders for 2023 to 2025 was 85.49 million yuan, 122 million yuan, and 118 million yuan respectively, with annual cash dividend payout ratios exceeding 21 percent. The net proceeds from two previous fundraising rounds totaled 627 million yuan. The 2022 private placement net proceeds of 390 million yuan have been fully invested. As of the end of June 2026, 170 million yuan of the 237 million yuan net proceeds from the 2024 simplified procedure private placement had been used, with the remaining funds to be continuously invested in dry film photoresist production lines and semiconductor photoresist research and development projects, expected to be fully utilized by 2027.