SUZHOU TIANMAI THERMAL TECHNOLOGY

Suzhou Tianmai announced plans to acquire a 100% equity stake in Hainan Siyang Investment Co., Ltd. through a cash transaction, thereby indirectly holding a 56.6750% stake in Chengdu Zhongleng Cryogenic Technology Co., Ltd. and consolidating Zhongleng Technology into its financial statements. Zhongleng Technology plans to introduce other investors through a capital increase and share expansion, after which the company's indirect shareholding will change to 51.00%. Zhongleng Technology primarily engages in the research and industrialization of refrigeration and engineering thermophysics technologies, focusing on high and low temperature intelligent equipment for the pan-semiconductor sector. Following this transaction, Zhongleng Technology's refrigeration and engineering thermophysics technologies will complement the company's thermal management technologies, extending its thermal management industry chain and expanding its high and low temperature intelligent equipment business in the pan-semiconductor field.

Suzhou Tianmai announced that its board of directors has approved a plan to issue convertible corporate bonds to non-specific investors, with total proceeds not exceeding 786 million yuan. The funds will be used for the first phase of the Suzhou Tianmai thermal conductive and heat dissipation product smart manufacturing base in Luzhi. Each bond has a face value of 100 yuan, a term of six years, and an initial conversion price of 267.33 yuan per share. In addition, the company plans to conduct foreign exchange hedging business with an amount not exceeding the equivalent of 300 million US dollars, and intends to acquire 100% equity of Hainan Siyang with cash, thereby indirectly holding a 51% stake in Zhongleng Technology, in order to expand its high- and low-temperature smart equipment business in the pan-semiconductor sector.