Xintec

Xintec Inc. is a wafer-level chip-scale packaging company operating in Asia, the United States, and Europe. It provides wafer-level chip-scale packaging, wafer-level back-cover packaging, and semiconductor testing services. The company also offers optical sensor chip-scale packaging, micro-electromechanical systems sensor packaging, and related services such as 3D I/O redistribution and power ground enhancement. Founded in 1987, Xintec is headquartered in Taoyuan City, Taiwan.