ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It operates through Packaging, Testing, and EMS. The company offers semiconductor packaging, interconnect materials production, front-end engineering testing, wafer probing, and final testing services, as well as integrated solutions for EMS (electronic manufacturing services) in relation to computing, peripherals, communications, industrial, automotive, and server applications. It also provides turnkey services, such as packaging, testing, and direct shipment of semiconductors to end users; wire bonding, including lead frame and substrate-based packages; advanced packages; heterogeneous integration; and other test-related services. In addition, the company engages in the leasing of properties; development, construction, sale, and management of real estate properties; management of parking lot; leasing of properties for shopping center; and management of commercial complex services and department store trading activities, as well as offers social, marketing and sales, information software, leasing and investing, and after-sales and sales support services. Further, it engages in the substrates production; investment advisory and warehousing management; design and manufacturing of electronic components and new electronic applications; technical advisory; management, training, and consulting of organization and human resources; projection of plastic; manufacture and sale of antennas, RF amplifiers and wave straps, PCBs, and tuners; and research and development activities. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.
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ASE Technology's ATM Business Drives Record Revenue and Margin Growth
ASE Technology Holding reported record ATM revenues of TWD 126.1 billion in the second quarter of 2026, up 36% year over year and 12% sequentially, driven by strong demand for advanced packaging and testing services. ATM gross margin rose 5.4 percentage points to 27.3%, while operating margin expanded 6.2 percentage points to 15.7%, with operating profit up 124% year over year. The ATM segment now accounts for 66% of consolidated revenues and 94% of operating profit, up from 61% and 87% respectively a year earlier. Management expects third-quarter ATM revenues to grow 11-13% sequentially with gross margin between 28% and 29%, and fourth-quarter gross margin to exceed 30%. The Zacks Consensus Estimate projects 2026 revenue growth of 27.9% and EPS growth of 112.3%.
AMD to Invest Over $10 Billion in Taiwan Semiconductor Ecosystem
Advanced Micro Devices plans to invest more than $10 billion in Taiwan through 2029 to expand advanced chip packaging, chip substrates, and AI system manufacturing capacity across the island's semiconductor ecosystem. The investment will support partners including TSMC, ASE Technology, Siliconware Precision Industries, and Powertech Technology, and help scale production of next-generation products such as AMD's Helios AI racks. AMD's Data Center revenue grew 107% year-over-year to $6.7 billion in the second quarter, and management expects data center AI revenue to grow at a compound annual growth rate above 80% over the next three to five years. CEO Lisa Su is investing now to ensure AMD can manufacture enough hardware if rapidly growing AI demand translates into large-scale deployments.
Advanced Packaging Concept Surges as JCET Rebounds to Hit Limit Up
The advanced packaging concept sector in China's A-share market continued to strengthen in the afternoon session. JCET, which fell over 6 percent yesterday, rebounded to hit limit up, with its market capitalisation reaching 185.2 billion yuan. Shenzhen Keda recorded a 20 percent limit up, while more than ten stocks including Xingye Co., Ltd., Langdi Group, Huatian Technology, and Xuguang Electronics were firmly locked at limit up. On the news front, a Huawei semiconductor executive released version two of the Tao Law, identifying five key implementation technologies including LogicFolding unit-level 3D stacking. In addition, ASE Technology Holding, a leading global OSAT supplier, has once again adjusted its packaging quotes, with price increases of up to over 20 percent, covering advanced packaging technologies such as CoWoS and FoCoS. The market expects other packaging and testing firms may follow suit. TSMC has also initiated price adjustments for advanced nodes, covering 3-nanometer, 7-nanometer and more advanced process nodes, with overall adjustments ranging from 5 to 10 percent. Wanlian Securities believes that ASE's price hike indicates strong industry sentiment in advanced packaging, and Huawei's new paper may help drive breakthroughs in domestic high-end chip technology. Yole expects the global advanced packaging market to grow from 54 billion US dollars in 2025 to 109 billion US dollars in 2031, with 2.5D and 3D packaging becoming the main growth driver.
BofA lifts ASE Technology price target to $48, reaffirms Buy rating
Bank of America raised its price target on ASE Technology Holding to $48 from $36 and reaffirmed a Buy rating, citing the company's positioning to benefit from AI infrastructure expansion across GPUs, ASICs, and server CPUs via its VIPack solution. ASE Technology reported unaudited consolidated net revenues of NT$173,662 million for fiscal Q1 2026, up 17.2% year-over-year but down 2.4% sequentially. Net income attributable to shareholders was NT$14,148 million, compared to NT$7,554 million a year earlier and NT$14,713 million in the prior quarter, with basic earnings per share of NT$3.24.
ASE Technology Hldg Upgraded to Zacks Rank #1 (Strong Buy)
ASE Technology Hldg has been upgraded to a Zacks Rank #1 (Strong Buy), reflecting an upward trend in earnings estimates. The Zacks Consensus Estimate for the company has increased 8.4% over the past three months, with analysts now expecting earnings of $0.84 per share for the fiscal year ending December 2026. The upgrade places ASE Technology Hldg in the top 5% of Zacks-covered stocks, indicating a strong potential for near-term price movement.
Amkor's 2.5D packaging pipeline seen driving long-term growth
Amkor Technology's expanding 2.5D packaging pipeline is emerging as a key growth lever as AI and high-performance computing customers shift toward chiplet-based architectures. The company maintains over a dozen active 2.5D engagements with leading semiconductor customers and expects several advanced packaging programs to ramp up over the next few years, including high-density fan-out and bridge-based solutions tied to CPU and data center applications. First-quarter 2026 revenues increased 27% year over year to $1.68 billion, supported by growing AI data center demand and higher advanced packaging content, while advanced packaging revenue from computing applications is expected to triple in 2026. Amkor competes with ASE Technology and Advanced Micro Devices in the 2.5D packaging ecosystem, and its shares have surged 103.2% year to date, outperforming the Zacks Electronics - Semiconductors industry's 59.5% gain. The Zacks Consensus Estimate for second-quarter 2026 earnings is 47 cents per share, indicating growth of 113.64% year over year.
ASE Technology Outperforms Amkor as AI Packaging Demand Surges
ASE Technology and Amkor Technology both reported strong first-quarter 2026 results driven by AI-fueled demand for advanced semiconductor packaging, but ASE Technology holds the edge in growth, profitability, and earnings outlook. ASE Technology posted NT$173.7 billion in revenue, up 17% year over year, with its Assembly, Testing and Material business reaching a record NT$112.4 billion, while Amkor achieved record revenue of $1.68 billion, a 27% increase. ASE Technology shares have surged 149.8% year to date, outpacing Amkor's 99.4% gain, and analysts expect ASE Technology's earnings per share to grow 47.4% in 2026 and another 73.2% in 2027, compared with Amkor's projected 38.7% growth this year and just 3.7% next year. ASE Technology also trades at a slightly lower forward price-to-earnings multiple of 35.33 times versus Amkor's 37.11 times, while both stocks carry premium valuations relative to the industry average of 33.61 times. The analysis concludes that ASE Technology's faster revenue growth, superior margin profile, stronger AI-driven momentum, and better long-term earnings trajectory make it the more compelling investment in the chip packaging space.
ASE Technology Holding expands capacity with 15 new sites to meet AI demand
ASE Technology Holding, the world's largest chip packaging and testing provider, is expanding capacity to meet AI demand, Chief Operating Officer Tien Wu said on Wednesday. The company is adding 15 new sites this year, including six greenfield sites for ASE, seven greenfield sites for its unit Siliconware Precision Industries, and sites acquired from Taiwan's Innolux Corporation earlier this year. Wu reiterated that this year's capital expenditure is budgeted at $8.5 billion and may exceed that amount. The factory expansion is not just for the next two years, but for 2029 and beyond to meet strong AI demand. The company has been investing in the U.S., with two testing factories in California and two more factories planned, while regarding investment in Arizona at a particular customer's request, Wu said the company has been evaluating plans but needs to carefully consider what investments to make.
ASE Technology's Margin Expansion Hinges on Advanced Packaging and AI Demand
ASE Technology's first-quarter 2026 gross margin expanded to 20.1% from 16.8% a year ago, while operating margin improved to 10.1% from 6.5%, driven by a richer mix of Assembly, Testing and Materials revenue and growing demand for advanced packaging services. The company raised its 2026 LEAP revenue outlook by about 10% to more than $3.5 billion and expects second-quarter consolidated gross margin to improve another 20 to 100 basis points sequentially. Management reiterated that ATM margins should continue rising through 2026 and reach the upper end of the company's structural margin range by year-end as AI-related packaging demand remains strong. However, accelerated investments in new LEAP production lines could temporarily weigh on quarterly profitability before new capacity begins contributing in the fourth quarter. ASE Technology's stock has surged 151.9% year to date, and the Zacks Consensus Estimate for its 2026 earnings per share has increased to 82 cents from 77 cents over the past 60 days.
Amkor Communications Revenue Surges 42% on Premium Smartphone Demand
Amkor Technology's communications segment delivered 42% year-over-year revenue growth in the first quarter of 2026, driven by healthy iOS ecosystem demand and stable Android shipments across premium tiers. The company is expanding advanced packaging capacity in Korea and Taiwan while shifting select systems-in-package production to Vietnam, aiming to support higher-value programs. Communications revenue is guided to grow in the mid-to-high single-digit range sequentially in the second quarter, with the full-year outlook improving toward high single-digit growth and potentially approaching double digits. However, material pricing pressures tied to advanced silicon and substrate costs, along with geopolitical uncertainty, could complicate margin capture, and concentration within premium-tier programs and the iOS ecosystem leaves the segment exposed to demand timing shifts. The Zacks Consensus Estimate for second-quarter advanced products revenues is pegged at 1.52 billion dollars, implying 24 percent growth from the year-ago period. Amkor faces increasing competition from ASE Technology and Taiwan Semiconductor Manufacturing Company, both expanding advanced packaging capabilities for premium smartphones.