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JCET Group Co Ltd

JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit back-end and technology services in China, South Korea, the United States, and internationally. The company offers turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments; design solutions; and characterization services, such as mold flow, mechanical, and electrical analysis, as well as thermal analysis test. It also provides packaging solutions comprising wirebond, flip chip, wafer level, power device, and MEMS and sensors packaging, as well as wafer bumping, system-in-package, and advancement of mainstream package; and testing solutions, which include test platform, wafer sort, test development, and ITMS, as well as RF, mixed-signal, memory/3D, digital, strip, post, and final tests. In addition, the company is involved in sewage treatment; investment activities; and trading. Its products are used in automotive, computing, storage, edge AI, and power and energy applications. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. JCET Group Co., Ltd. was founded in 1972 and is based in Jiangyin, China.

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Semiconductors

Huatian Technology's first-half net profit surges 259%, with stock investments contributing nearly half of profit

Huatian Technology disclosed its 2026 semi-annual report. In the first half of the year, it achieved operating revenue of 10.511 billion yuan, up 35.09% year on year, and net profit attributable to shareholders of the listed company of 813 million yuan, a sharp year-on-year increase of 259.15%. Second-quarter operating revenue was 5.711 billion yuan, a record high for a single quarter, with net profit of 727 million yuan. The company said the performance growth was mainly due to a recovery in semiconductor industry sentiment, rising demand in the packaging and testing market, and expanded scale of automotive electronics and memory packaging businesses. However, net profit after deducting non-recurring items was only 250 million yuan, with total non-recurring gains and losses of 563 million yuan. Among them, fair value changes and gains or losses from disposal of securities investments amounted to 487 million yuan, accounting for nearly half of total profit, mainly from investment income on holdings in stocks such as Huahai Chengke, Youxun, Huizhiwei, and JCET. The total number of shareholders increased from 402,658 at the end of the first quarter to 862,569, a rise of 114.22%. Overseas funds increased their positions overall, while two ETF products and the second phase of the National Integrated Circuit Industry Investment Fund reduced their holdings by more than 65.87 million shares in total.
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JCET's 2026 interim net profit reaches 845 million yuan, up 79.41% year on year

JCET has released its 2026 interim report, with net profit attributable to the parent company of 845 million yuan, up 79.41% from the same period last year. Total operating revenue was 19.527 billion yuan, up 4.96% year on year, marking a third consecutive year of growth. Net cash inflow from operating activities was 2.964 billion yuan, up 26.75% year on year. The company's latest gross margin was 15.15%, rising for five consecutive quarters. Diluted earnings per share were 0.47 yuan, up 80.77% year on year.
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Traditional Chinese Medicine Stocks Surge Against the Market as Pien Tze Huang and ZBD Pharma Hit Limit Up, While Chip Stocks Plunge Across the Board

China's A-share market underwent volatile adjustments today, with the Shanghai Composite Index falling 1.85 percent and losing the 3,900-point level. However, the traditional Chinese medicine sector surged against the market, with Pien Tze Huang and ZBD Pharma hitting their daily limit up in the afternoon. The pharmaceutical and biological industry saw a net inflow of over 5 billion yuan in main funds, and the TCM sector index rose more than 3 percent at one point during the session, marking seven consecutive positive daily candlesticks. Harbin Pharmaceutical Group locked in its fifth straight daily limit up, while Hainan Haiyao achieved its second consecutive daily limit up. Chip stocks, on the other hand, suffered a broad sell-off, with the semiconductor sector index plunging more than 5 percent. Companies such as JCET and Demingli hit limit down in batches. Global chip stocks also faced heavy selling, with South Korea's SK Hynix tumbling 11.53 percent and Japan's Kioxia plummeting 15.03 percent. On the news front, the State Council approved the 15th Five-Year Plan for the Revitalization and Development of Traditional Chinese Medicine, and the 2026 edition of the National Essential Medicines List added 48 new proprietary Chinese medicines.
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Shanghai Composite Index Falls as Q2 GDP Slows and Tech Stocks Weigh

In mainland China markets on the 15th, the Shanghai Composite Index fell 0.29% from the previous day to 3,955.58 points, reversing earlier gains. The April–June GDP growth rate released during trading hours came in at 4.3%, below the market forecast of 4.5% and decelerating from the previous quarter's 5.0%, which weighed on sentiment. Tech stocks were notably weak, with the STAR 50 Index dropping 4.3% and underperforming major indices. Jiangsu Changjiang Electronics Technology hit its daily limit down with a 10.0% decline, and ACM Research fell 9.2%. On the other hand, consumer-related shares were firm, with Shanxi Xinghuacun Fen Wine rising 7.0% and China Tourism Group Duty Free gaining 6.9%.
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Semiconductorsimpact 4

Advanced Packaging Concept Surges as JCET Rebounds to Hit Limit Up

The advanced packaging concept sector in China's A-share market continued to strengthen in the afternoon session. JCET, which fell over 6 percent yesterday, rebounded to hit limit up, with its market capitalisation reaching 185.2 billion yuan. Shenzhen Keda recorded a 20 percent limit up, while more than ten stocks including Xingye Co., Ltd., Langdi Group, Huatian Technology, and Xuguang Electronics were firmly locked at limit up. On the news front, a Huawei semiconductor executive released version two of the Tao Law, identifying five key implementation technologies including LogicFolding unit-level 3D stacking. In addition, ASE Technology Holding, a leading global OSAT supplier, has once again adjusted its packaging quotes, with price increases of up to over 20 percent, covering advanced packaging technologies such as CoWoS and FoCoS. The market expects other packaging and testing firms may follow suit. TSMC has also initiated price adjustments for advanced nodes, covering 3-nanometer, 7-nanometer and more advanced process nodes, with overall adjustments ranging from 5 to 10 percent. Wanlian Securities believes that ASE's price hike indicates strong industry sentiment in advanced packaging, and Huawei's new paper may help drive breakthroughs in domestic high-end chip technology. Yole expects the global advanced packaging market to grow from 54 billion US dollars in 2025 to 109 billion US dollars in 2031, with 2.5D and 3D packaging becoming the main growth driver.
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