Tong Hsing Electronic Industries Ltd

Tong Hsing Electronic Industries, Ltd. develops and produces thick film substrates and customized semiconductor micro-module packaging. Its offerings include ceramic metalized substrates such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates. The company also provides CMOS imaging products, including wafer probing and testing, wafer reconstruction, packaging, and image testing, as well as high frequency wireless communication modules, power semiconductor module packaging, and customized module packaging and testing for hybrid integrated circuit modules and biomedical products. Its products serve automotive, handset, aerospace and network, medical, and other applications. The company was incorporated in 1974 and is based in New Taipei City, Taiwan.