Union Semiconductor (Hefei) Co. Ltd. A

Union Semiconductor (Hefei) Co., Ltd. provides integrated circuit packaging and testing services to display driver chip design companies in China and internationally. Its services include bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, and electronic tags. The company was founded in 2015 and is headquartered in Hefei, China.