Yunnan Lincang Xinyuan Germanium Industrial Co LtdSubsidiary signed indium phosphide wafer supply agreement worth 570-855 million yuan, 53-80% of 2025 revenue.
On the evening of July 23, multiple listed companies on the Shanghai and Shenzhen stock exchanges released important positive announcements. Yunnan Germanium's holding subsidiary Yunnan Xinyao signed an indium phosphide wafer supply agreement, with an estimated total contract value of 570 million to 855 million yuan, accounting for 53.48% to 80.23% of the company's 2025 annual revenue, and deliveries will be made in batches from August 2026 to the end of 2027. Hongjing Optoelectronics plans to issue convertible bonds to raise no more than 630 million yuan for research and industrialization projects including diversified application lens modules. Pengding Holdings plans to invest 10 billion yuan to build a new third campus in Shenzhen, constructing an intelligent manufacturing base for high-end AI-related substrate-like PCBs and flexible circuit boards, with construction scheduled to start in July 2026 and be completed and put into production by 2033. Zhongyuantong's wholly-owned subsidiary Weipo plans to invest 10 million yuan of self-raised funds to build an energy storage PACK production line, expected to complete commissioning by the end of September 2026. Taijing Technology stated on an interactive platform that its high-frequency products have been supplied in batches to some optical module, server, and data center customers. Minmetals New Energy expects a net profit of 340 million to 400 million yuan in the first half of 2026, turning from a loss to a profit year-on-year, mainly due to the rapid development of the new energy vehicle and energy storage industries and a significant increase in product sales. Jiangbolong's chairman proposed to repurchase shares worth 400 million to 800 million yuan for equity incentives or employee stock ownership plans. Xingye Technology's wholly-owned subsidiary Jiangsu Xingguang acquired the indium phosphide substrate manufacturing and sales business of Qingdao Li'ang for 55 million yuan in cash. The business has total assets of 17.0246 million yuan, net assets of 6.3704 million yuan, revenue of 2.3438 million yuan in the first five months of this year, a net loss of 1.4409 million yuan, and orders on hand not exceeding 2 million yuan, with an expected minimal impact on current profits. Montage Technology plans to repurchase shares worth 300 million to 600 million yuan, with a repurchase price not exceeding 332.90 yuan per share, to maintain company value and shareholder equity. Redboard Technology's wholly-owned subsidiary Ganzhou Redboard plans to invest no more than 5 billion yuan to build an industrialization project for high-end mSAP precision circuit boards, and also plans to invest no more than 300 million yuan to construct Building D1 and auxiliary facilities. The company itself also plans to invest no more than 700 million yuan for technical transformation and capacity expansion of high-precision HDI circuit board production lines.
Yunnan Lincang Xinyuan Germanium Industrial Co LtdSubsidiary signed indium phosphide wafer supply agreement worth 570-855 million yuan, 53-80% of 2025 revenue.
Avary Holding Shenzhen Co Ltd Class APlans to invest 10 billion yuan to build a new campus for AI-related PCB and flexible circuit board manufacturing.
Guangdong Hongjing Optoelectronic Technology Inc.Plans to issue convertible bonds up to 630 million yuan for R&D and industrialization projects.
Jiangxi Redboard Tech Co LtdChairman proposed share repurchase of 400-800 million yuan for equity incentives.
Xingye Leather Technology Co Ltd
Shenzhen Longsys Electronics Co. Ltd. A
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Montage Technology Co Ltd
Hunan Changyuan Lico Co LtdWholly-owned subsidiary plans to invest 10 million yuan to build an energy storage PACK production line.