HANA Micron Inc

HANA Micron Inc. provides semiconductor packaging and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, molded underfill, flexible packaging for silicon-based IC chips, bumping products, WLP DSPs, fingerprint sensor assemblies, SIP and EMI shields, multi-chip FBGA packages, and lead frame-based packages such as quad flat no lead, thin small outline, thin shrink small outline, and quad flat packages. The company also offers RF, SOC, analog, and logic test services, along with test technical support, test auto loading management systems, and test equipment. In addition, it manufactures and sells silicon cathodes, ingots, and rings for the semiconductor and solar industries. Founded in 2001, it is headquartered in Asan, South Korea.