Winstek Semiconductor Co Ltd

Winstek Semiconductor Co., Ltd. provides integrated circuit testing, chip bumping, and wafer packaging services in Taiwan, the United States, Mainland China, Singapore, and other international markets. It operates through two segments: Test Business and Packaging Business. Its services include wafer sort, final test, post-test, engineering support, and test platforms; bump services such as copper pillar bump, wafer level chip scale package, lead-free bump, plating bump/ball drop/RDL, 6S protection, heterogeneous bump, and backside metallization; backend services including die processing, wafer thinning, singulation, and flip chip; and verification analysis services such as failure analysis, reliability testing, and electrical and thermal simulation. The company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. and changed its name to Winstek Semiconductor Co., Ltd. in June 2015. Founded in 2000, it is headquartered in Hsinchu City, Taiwan, and is a subsidiary of SIGWIN Corporation.