Zen Voce

Zen Voce Corporation manufactures, processes, maintains, and sells semiconductor packaging and testing equipment and fixtures in Taiwan, the United States, China, Singapore, and internationally. The company designs and manufactures equipment such as IC packaging machines, bumping products, wafer cutting and cleaning machines, and board cutting and cleaning machines, as well as test products including wafer test probe card PCBs, IC test HIFIX and CHANG kits, SOCKET IC test products, IC handlers, and SOCKET IC burn-in test products. It also offers wafer and packaging dicing equipment, solder ball mounting equipment, consumables and accessories, logical and memory applications, burn-ins, and optoelectronic assembly testing products. In addition, it acts as an agent for semiconductor burn-in test connectors, MEMS equipment, solar equipment, and LCD inspection equipment, and exports its products to the semiconductor, optoelectronics, microelectronics, and LCD equipment industries. Founded in 1999, Zen Voce Corporation is headquartered in Hsinchu City, Taiwan.