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China Wafer Level Csp Co Ltd

China Wafer Level CSP Co., Ltd. develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. Its products include image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices. The company also provides manufacturing services for TSV and 3DIC technology, along with design, test, and logistics solutions. Founded in 2005 and headquartered in Suzhou, China, it serves mobile handset manufacturers and semiconductor chip design houses.

Price · split & dividend adjusted
News & notes moving 603005.CG
603005.CG3

China Wafer Level CSP's first-half net profit falls nearly 20%, forex losses surge eightfold

China Wafer Level CSP has disclosed its semi-annual report for 2026. First-half operating revenue was 676 million yuan, up 1.39% year on year. Net profit attributable to the parent company was 133 million yuan, down 19.50% year on year. Net profit after deducting non-recurring items was 119 million yuan, down 21.47% year on year. The decline in net profit was mainly due to foreign exchange losses caused by currency fluctuations and higher intermediary fees for the spin-off and listing of an overseas subsidiary. Net foreign exchange losses in the first half were 22.55 million yuan, compared with only 2.31 million yuan in the same period last year, a more than eightfold increase. The company's gross margin rose from 45.08% to 46.01%, but its net margin fell from 23.91% to 19.64%. Affected by the weaker results, China Wafer Level CSP's share price opened sharply lower on August 25, falling more than 8% at one point. As of press time, it was down 6.16% at 29.70 yuan per share.
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