Chipbond Technology

Chipbond Technology Corporation, along with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing, bumping manufacturing (gold, solder, and copper), redistribution layer services, test services, and die processing such as wafer grinding/thinning, dicing, and tape-and-reel. It also provides chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. Additionally, it supplies compound semiconductors (SiGe, GaAs, GaN, SiC, and other wafers), flexible tape-and-reel circuit substrate, and chip trays, and develops, manufactures, packages, tests, sells, and provides after-sales services for integrated circuits and special materials for semiconductors. The company was incorporated in 1997 and is based in Hsinchu City, Taiwan.