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Towa Corporation

TOWA Corporation designs, develops, manufactures, and sells semiconductor manufacturing equipment and high-precision molds in Japan and internationally. It operates through three segments: Semiconductor Manufacturing Equipment, Medical Device, and Laser Processing Equipment. The Semiconductor Manufacturing Equipment segment produces precision molds, molding equipment, and singulation equipment, and provides after-sale services. The Medical Device segment manufactures and sells medical devices and other products, while the Laser Processing Equipment segment manufactures and sells laser processing equipment and provides after-sale services. Its products also include precision molds, end mills and drill series, TEN-systems, and mold release films. The company was formerly known as TOWA Precision Industries Limited and changed its name to TOWA Corporation in December 1988. TOWA Corporation was incorporated in 1979 and is headquartered in Kyoto, Japan.

Price · split & dividend adjusted
News & notes moving 6315.JP
Semiconductors

TOWA Reports Higher Revenue and Return to Profit for April-June Quarter, but Shares Fall Despite Strong Results

Semiconductor manufacturing equipment maker TOWA announced results for the first quarter of the fiscal year ending March 2027, with revenue up 100.3 percent year on year to 16.183 billion yen, operating profit of 2.212 billion yen marking a return to the black, and orders of 21.811 billion yen, a record high on a quarterly basis. Benefiting from expanding capital investment in semiconductors for AI and data centers, its mainstay semiconductor manufacturing equipment business accounted for 93.5 percent of revenue, with strong demand for molding equipment in the memory segment. However, the company kept its full-year forecast for ordinary profit at 10.24 billion yen, a conservative level about 22 percent below the market consensus of 12.525 billion yen, and profit-taking after a roughly 71 percent rise from the year-to-date low weighed on the stock. On the next trading day after the earnings announcement, the share price plunged 11.47 percent from the previous day to 2,532 yen.
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