Micro Silicon Electronics Co., Ltd.

Micro Silicon Electronics Co., Ltd. provides semiconductor backend services in Taiwan, the rest of Asia, the United States, and Europe. Its offerings include semiconductor testing services such as CP and FT testing, wafer thinning services including back grinding, backside metallization, and frontside metallization, and semiconductor packaging services comprising COB and COG dicing and WLCSP-DPS. The company also designs, processes, tests, manufactures, and sells integrated circuits, and provides probe card maintenance services. Founded in 1987, it is headquartered in Zhunan, Taiwan.