Megatrend · Critical Materials

The stuff that's less than 1% of a chip's cost — but if it runs out, the whole fab stops

The world talks about TSMC, NVIDIA, and multi-billion-dollar EUV machines. But no chip can exist without another pile of "snacks" almost nobody sees — photoresist, polishing slurry, specialty gases, and metal sheets purified to nine-nines — fed onto the wafer drop by drop across hundreds of steps. Together they're a market of just ~$67 billion — a fraction of the chip value they create — yet some have only 2–3 makers on Earth, and almost all of them are in Japan. This is the truest chokepoint of the chip era.

Category Critical Materials Level segment (fab consumables) Status Fast-growing · highly concentrated Read time ~13 min
A round silicon wafer in the center, with several thin streams of droplets and gas flowing in to feed it from every direction, conveying the invisible chemicals and materials fed into chipmaking.
ภาพประกอบ (hero.webp)
A chip's invisible ingredients. A single wafer is fed with dozens of liquids, gases, and powders, drop by drop across hundreds of steps — these are the "consumables" that make a chip actually possible.

01What it is (the invisible consumables)

When we talk about "making chips," we usually picture giant billion-dollar machines like ASML's EUV tools and TSMC's fabs. But inside a fab, a single silicon wafer doesn't just get "blasted with light" — it has to be coated, deposited, etched, polished, and washed with dozens of ultra-high-purity chemicals and materials, over and over, hundreds of times, before it becomes a single chip.

That's the heart of this lesson — electronic & semiconductor materials, the consumables used up in making chips, displays, and printed circuit boards (PCBs). Not the machines, not the chips, but the "food" fabs have to refill every day. There are five main families:

Five material families worth knowing
Photoresist · Wet chemicals / Slurry · Specialty gases · Sputtering targets · Precursors

Photoresist = a light-sensitive liquid spread thin on the wafer to "receive" the circuit pattern from light · Wet chemicals / CMP slurry = acids, solvents, and tiny polishing powders used to etch and "shave the wafer's surface flat to the atom" · Specialty / electronic gases = ultra-high-purity gases used to etch, deposit, and dope the silicon · Sputtering targets = pure metal sheets (copper, tantalum, tungsten) "shot" so their atoms fly off and deposit as a thin film on the wafer · Precursors = starter molecules that vaporize and build nanometer-thin films one layer at a time.

The key is to tell it apart from its "close relatives." On our megatrend map, this node is a sub-branch of Specialty Chemicals & Industrial Gases under Critical Materials & Supply Chain — it's the "consumables that get used up," while the starting wafer and base substrate live in another node, Semiconductor Materials. Put simply: that node is the "blank paper," and this node is the "ink and chemicals" that draw the circuit onto it.

02Why cheap stuff is a chokepoint for the whole industry

Start with size. The global semiconductor-materials market is around $67.5 billion in 2024 and hit a new record of $73.2 billion in 2025, per SEMI. That sounds like a lot, but it's a fraction of the chip value it creates — the global chip market is over $600 billion, and those chips drive a digital economy worth trillions.

This block of materials splits into two big buckets. The first is wafer fab materials, around $42.9 billion — the photoresists, chemicals, and gases used while building the circuit on the wafer. The other is packaging materials, around $24.6 billion, used when the chips get packaged into individual units.

The materials in a fab split into two piles
Global semiconductor-materials market in 2024 ($B) — total ~$67.5B
Source: SEMI — Materials Market Data Subscription (2024)

Now the heart of it: why does "cheap stuff" have such enormous power? The answer is cost. Look at this number: a single 300mm wafer built on the most advanced technology (say, 3 nanometers) can be worth up to ~$25,000, yet all the chemicals and materials used on that wafer add up to only about $2,000 — less than a tenth of its value.

Cheap, but impossible to skip
Value per 300mm wafer at the leading node ($) — materials are a fraction of the total
Source: industry estimates (chemical cost ~$2,000/wafer at 3nm; finished wafer up to ~$25,000)

But cheap doesn't mean unimportant — quite the opposite. Some of these have only 2–3 makers on Earth, and switching one chemical's formula takes a year of testing and qualifying on the production line. If the main photoresist runs short, a $200 million EUV machine just sits there idle, because there's nothing for it to "expose." That's what chokepoint means — cheap stuff that, if it runs out, stops the whole line.

< 1% Consumables are a tiny share of a chip's value, but they control whether the fab runs — because some have only 2–3 main makers worldwide, and you can't swap suppliers overnight.

03How it works (feeding materials onto the wafer, drop by drop)

The easiest way to understand this node is to see chipmaking as a "chemical assembly line." A blank wafer goes in and loops through the same stations hundreds of times, with different material families "fed in" at different moments each cycle. Let's trace where each material comes in.

Electronic materials are fed onto the wafer at each step of chipmaking A blank wafer loops through 5 stations — deposit film, apply photoresist, etch the pattern, polish flat, and wash — with different material families dripping in from above at each station, repeated hundreds of times. Blank wafer Sputtering target + precursor 1 Film deposition Photoresist (light-sensitive liquid) 2 Apply resist + expose Specialty gas + HF acid 3 Etch the pattern Slurry (CMP slurry) 4 Polish flat Pure chemicals (wet clean) 5 Wash Repeated hundreds of times, per chip layer Chip
A chemical assembly line. The wafer loops through the same stations hundreds of times, with different material families fed in each cycle — miss any one, and the whole line can't run.

The real difficulty of this business isn't "making the chemical" — it's how "clean" you can make it. In the world of chips, impurities down to "a few atoms per billion" can ruin a whole wafer. The starting silicon has to be pure to 99.9999999% (what the industry calls "9N," or nine-nines), and the gases and chemicals have to be just as pure. This is the node's moat — whoever makes their stuff the cleanest and most consistent wins.

A vast, bright-white cleanroom with one tiny colored speck that must be removed, conveying nine-nines purity where even the slightest impurity is unacceptable.
ภาพประกอบ (purity.webp)
A war of cleanliness. At 9N, just a few atoms of impurity per billion can ruin a chip — purity is the product customers actually pay for.

04What it connects to

This node sits "upstream" of the entire digital world. Its inputs come from Industrial Gases (a sibling under the same parent node, feeding basic high-purity gases) and Semiconductor Materials (the wafers and base materials this node "draws circuits" onto) — two close relatives that work side by side in the same fab.

But what matters more are the "mouths waiting to be fed" downstream. These materials feed straight into Semiconductors — the heart of every chip — and those chips flow on to feed almost every megatrend of the era: Artificial Intelligence and Cloud & Digital Infrastructure (modern AI chips are more complex and eat more steps and chemicals), Electrification & Mobility (power chips in EVs), and Defense & Geopolitical Fragmentation (military and space chips).

What's fascinating is that this node is the "picks-and-shovels seller" of the AI revolution — whether NVIDIA, AMD, or anyone wins the chip war, every fab still buys photoresist, slurry, and specialty gases from the same group of makers. And the more complex chips get (more steps, higher purity), the more of these materials they consume per wafer.

05Where it stands now

There's one thing you have to grasp about this field first: how concentrated it is in a few countries, especially Japan. The clearest example is photoresist — Japanese companies control about 75% of the world's semiconductor-photoresist market, and if you narrow it to resist for EUV (the leading-edge technology), three Japanese firms — Tokyo Ohka Kogyo, JSR, and Shin-Etsu — together hold over 90%.

Who controls the world's photoresist
Global semiconductor-photoresist market share (2024)
Source: industry data compilation (Japan ~75% of semiconductor photoresist; EUV-only, three Japanese firms >90%)

Why does this matter? Because the world has already seen this chokepoint used as a "weapon." In July 2019, Japan announced controls on exports of three chip chemicals to South Korea — advanced photoresist, hydrogen fluoride (HF), and fluorinated polyimide — requiring a license for each shipment. Korea was shaken instantly, because Samsung and SK Hynix together make 72% of the world's DRAM and half its NAND flash. HF exports from Japan to Korea dropped 87.9% during that stretch.

One small valve or tap controlling a giant pipe that feeds several chip fabs, conveying the power of a materials chokepoint that a single country can shut off.
ภาพประกอบ (chokepoint.webp)
One tap that can be shut off. In 2019, Japan showed the world that a few cheap chip chemicals can become a bargaining card that shakes an entire country's industry.

Korea hit back by racing to find "non-Japan" sources and build supply at home — SK Hynix poured about ₩320 billion ($268 million) into qualifying domestic materials between 2019 and 2021, and by 2022 the share of fluorinated polyimide Korea made itself rose from 3.1% to 18%. This episode became a wake-up call for the whole world to start seriously "diversifying" its chip-materials supply chain.

Another field just as hot is CMP slurry — a market of about $1.78 billion in 2024 where players like Japan's Resonac, DuPont, Merck (Versum), and Cabot compete fiercely. The more circuit layers a chip stacks (some over 100), the more often it needs polishing flat, so slurry is one of the fastest-growing groups. In this field, the real players split into three camps: Japanese materials giants that control photoresist and slurry, Western chemical/materials firms that sell purity and delivery systems, and Asian challengers climbing up in specialty materials.

Key players in this field
This field splits into three camps: Japanese materials giants that control photoresist and slurry · Western chemical/materials firms that sell purity and delivery systems · and Asian challengers climbing up in specialty materials — we place them by their role in the chain, not by raw market value.
Japan · a full line of chip materials
One of the world's most influential electronic-materials companies — a leading photoresist maker, a photomask-blank supplier, and the world's #1 in silicon wafers (wafers themselves sit in the Semiconductor Materials group). It embodies the Japanese model of controlling chip materials in the most 'integrated and purest' way.
core · photoresist / chip materials
Japan · specialty photoresist
A pioneer and world leader in photoresist, with almost the entire company focused on light-sensitive materials for chipmaking. One of the three Japanese firms that together hold over 90% of the EUV-resist market, co-developing EUV chemistry directly with Intel, Samsung, and TSMC — an example of a 'small specialist you can't do without.'
core · EUV photoresist
Japan · slurry + packaging
One of the world's leaders in CMP slurry and a major player in advanced-packaging materials, the new growth field of the chiplet era. Formed by the merger of Showa Denko and Hitachi Chemical, it holds one of the broadest electronic-materials portfolios around.
core · CMP slurry
Germany · electronic materials
A German chemical/pharma giant that became a global chip-materials player by acquiring Versum Materials and Intermolecular, covering deposition materials, slurry, and specialty gases/chemicals — a face of the Western firms that sell 'purity and delivery systems' to fabs worldwide.
secondary · deposition / CMP materials
EntegrisENTG · US
United States · purity and delivery
A specialist in the 'cleanliness' of a fab — making CMP slurry, filtration and purification materials, coatings, and the containers/piping systems that keep nine-nines purity along the whole line. The finer chips get, the more cleanliness matters, so Entegris benefits directly from every more-advanced node.
core · purity / filtration
Japan · sputtering targets
A world leader in sputtering targets (pure metal sheets used to deposit film onto wafers) and high-purity electronic chemicals, alongside a large commodity-chemicals business. An example of a player 'selling a specific-spot material' in the chip line that most people have never heard of.
secondary · sputtering targets
Shandong Sinocera300285 · CN
China · powders and electronic materials
A Chinese maker of functional ceramic materials and high-purity fine powders, feeding CMP materials, powders for capacitors (MLCC), and other electronic materials. A face of the Chinese challengers climbing up in specialty materials, in line with the country's strategy to cut reliance on imported materials.
core · electronic materials / powders

06The road ahead

Three forces will shape this business. One — the High-NA EUV era needs a new set of chemistry. Finer and finer chips need new photoresist formulas that are faster and sharper. The EUV-specific photoresist market alone is jumping from ~$226 million in 2024 to about ~$879 million by 2030 (over 25% a year) — several times faster than the overall materials market — and it's a field where the three Japanese firms still lead by a wide margin.

EUV photoresist — the fastest-growing part
Photoresist market size for EUV ($M) — 2030 is an estimate (CAGR ~25%)
Source: EUV Photoresists market data compilation ($226.4M in 2024 → $878.9M in 2030)

Two — every country wants its own materials supply. The 2019 lesson pushed the US, Europe, Korea, and China to pour money into building chip-materials plants at home, so no one can "shut the tap" on them again. This spreading of production opens doors for new players, but it also means more competition and more duplicated investment.

Three — advanced packaging materials are becoming a new field. As shrinking transistors starts hitting the limits of physics, the industry is turning to "stitching several chips together" (advanced packaging / chiplets) instead, which needs lots of new packaging materials — which is why the packaging-materials pile ($24.6 billion) is becoming a growth engine that giants like Resonac and Kingboard are betting heavily on.

07Challenges & risks

Concentration is double-edged. Having only 2–3 makers of some critical items gives the leaders pricing power and fat margins, but it also makes the whole industry fragile. A single natural disaster, a fire at one plant, or one geopolitical clash can cut off world supply overnight. And most recently, in 2025, there were rumors Japan might restrict photoresist exports to China, which instantly worried China's chip industry.

The same moat that protects you can lock you out. Because customers need a year to qualify a new material, incumbents gain a huge edge — but it also means new challengers (especially from China and Korea) break in slowly and with great difficulty, even if their product is nearly as good. So competition moves slowly and is decided by "trust" more than price.

You can't avoid following the chip cycle. Even as the fab's "daily food," material volumes are tied directly to the chip industry's ups and downs. When chip demand softens (like during a memory glut), fabs cut output and material sales shrink with them. So this node reaps the full upside of the AI wave — but also takes the full hit when the cycle flips.

The bottom line for investors: Electronic & Semiconductor Materials are the "invisible consumables" in a fab — three keys: (1) cheap (<1% of a chip's value) but a real chokepoint, because there are only 2–3 main makers and you can't swap suppliers overnight · (2) Japan owns the game, especially photoresist (~75% worldwide, EUV >90%), making it both a profit pool and a strategic point · (3) the AI wave + High-NA EUV + advanced packaging drive demand up, but concentration and the chip cycle are the risks to watch — this is the "picks-and-shovels seller" that benefits no matter who wins the AI war.
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